Topilo za spajkanje EF350 2,5 L Stannol

No-Clean flux classified as type 2.2.3.A according to DIN-EN 29454-1, type ORL0 according to EN 61190-1-1 and type ORL0 according to J-STD-004.

• Stannol EasyFlux 350 is halide-free activated.

Suitable for different surfaces (such as OSP, Ni/Au, HAL, chem Sn and chem.Ag) used in PCB manufacturing and so avoids problems when new printed circuit boards with alternative surfaces are introduced.

The EF350 may be used with lead-containing and lead-free solders, where best wetting result may be achieved.

Best results were achieved when using Stannol Ecoloy and Flowtin TSC (Tin/Silver/Copper), TS (Tin/Silver) and TC (Tin/Copper) alloys.

A low percentage of special additives were integrated into the flux formulation in order to meet the requirements on the soldering behaviour of the flux and the electrical safety of the residues, left after soldering.