Hladilnik Silverstone SST-AR09-115XP

SilverStone AR09-115XP is a compact CPU cooler made for 2U rackmount servers and small form factor cases. It features three 6 mm copper heat pipes with heat-pipe direct contact (HDC) to the base, a wave-shaped fin stack paired with an included air duct, and a 60 mm dual ball-bearing PWM fan that delivers focused airflow for effective CPU heat dissipation.

Advantages

The combination of three Ø6 mm heat pipes and aluminum fins provides efficient heat conduction from the CPU to the heatsink. HDC technology improves thermal transfer by maximizing contact between the heat pipes and the processor. The 60 mm dual ball-bearing PWM fan offers a wide speed range for balanced airflow and pressure, while the compact design and push-pin mounting simplify installation in constrained small form factor or 2U rack environments.

Suitable for

• 2U rackmount servers
• Small form factor (SFF) desktop cases
• Systems using Intel LGA1150 / LGA1151 / LGA1155 / LGA1156 sockets
• Applications requiring a low-profile CPU cooler with directed airflow

Key specifications

• Fan diameter: 60 mm
• Fan type: Dual ball bearing, PWM
• Fan speed range: 1200–5000 RPM
• Maximum air pressure: 4.83 mmH2O
• Heat pipes: Three Ø6 mm copper heat pipes
• Heatsink: Wave-shaped aluminum fins with dedicated air duct
• Mounting: Push-pin installation
• Form factor: Low-profile, suitable for 2U and SFF builds

How to use

Install the cooler onto a compatible Intel LGA1150/1151/1155/1156 socket following standard CPU cooler mounting procedures. Apply thermal paste to the CPU heatspreader, align the cooler base so the heat-pipe contact surface sits flush on the processor, and secure the push-pins into the motherboard holes. Connect the PWM fan cable to the CPU fan header to enable speed control.

Recommendations

For best results in compact systems, ensure the included air duct is correctly positioned to channel airflow through the wave-shaped fins and verify there is adequate case ventilation. Regularly check the fan for dust buildup and clean as needed to maintain optimal cooling performance.