Hladilno telo Alphacool 17427 baker 14 mm 10 kosov

Alphacool 17427 Copper 14mm heatsinks are compact passive cooling elements manufactured from copper to provide efficient thermal conduction and dissipation. Each pack contains 10 identical heatsinks with nominal dimensions of 14 mm × 14 mm, suitable for attaching to small heat sources on printed circuit boards or electronic components inside computer systems and other devices. The solid copper construction and compact footprint make these heatsinks appropriate when space is limited and reliable thermal transfer is required.

Advantages

Made from copper for high thermal conductivity, these 14 mm heatsinks transfer heat away from components more effectively than many aluminium alternatives. Their small 14 mm × 14 mm square profile allows placement on tight PCBs, memory modules, MOSFETs, voltage regulators and similar components. Supplied in a set of 10, the package supports multiple installations or spare-part needs without requiring repeated purchases. The simple geometry and flat base ensure consistent contact with component surfaces when used with thermal adhesive or thermal tape.

Suitable for

• Passive cooling of small ICs, MOSFETs and voltage regulators
• Cooling of memory chips and VRAM modules in compact builds
• Use on motherboards, expansion cards and custom electronics
• Repair, prototyping and multi-point thermal management in systems

Key specifications

• Material: copper for improved thermal conductivity
• Shape and size: square profile, approximately 14 mm × 14 mm footprint
• Thickness/height: 14 mm nominal overall dimension (square)
• Pack quantity: 10 pieces per package
• Surface finish: bare copper suitable for thermal adhesive or tape

How to use

Clean the component surface to remove dust, oils or residues before installation. Apply a thin layer of thermal adhesive, thermal paste, or use double-sided thermal tape on the base of the heatsink to ensure good thermal contact. Position the heatsink centrally on the heat source and hold in place until the adhesive sets or the tape bonds. For optimal results, ensure surrounding airflow is not obstructed and consider supplementing passive heatsinks with active cooling if component temperatures remain high under load.

Recommendations

Use these copper heatsinks where compact, passive heat dissipation is required. For best performance combine with a thin, thermally conductive interface material and maintain adequate case airflow. Avoid installing on components with irregular or highly curved surfaces without first planing or using a compliant thermal pad to ensure full contact.